爱发科 ULVAC SME - 200J用途：这是一款多腔体多功能集成的镀膜设备，主要面向压电薄膜的制备。既能满足先进压电薄膜材料的开发试制需求，也适用于压电薄膜产品的小批量生产。可提供以锆钛酸铅（PZT）和钪铝氮（ScAlN）为核心的成套压电薄膜材料生长解决方案。此外，因 PZT 材料在铁电、介电、热释电等方面的独特性能，该设备还能为铁电随机存储器、红外探测器、温度传感器等多种应用方向提供技术开发支持。性能：设备具备 7 个腔体，中部为传送腔，操作面为进样室，另有 5 个工艺腔体，具备压电薄膜制备一站式解决能力。可加工 8 英寸晶圆，每批能处理 10 片。拥有 4 个溅射腔室，阴极采用磁旋转阴极（上侧），直流功率 10kW ，基板电极配备水冷静电吸盘。蚀刻腔室电源天线 1kW，偏压 600W ，基板电极同样为水冷静电吸盘。设备操作面板具备集成控制功能，可实现自动化真空及沉积流程。

Product Name: ULVAC SME - 200JPurpose: This is a multi - chamber and multi - functional integrated coating device, mainly for the preparation of piezoelectric thin films. It can not only meet the development and trial - production needs of advanced piezoelectric thin - film materials but also be suitable for small - batch production of piezoelectric thin - film products. It can provide complete sets of piezoelectric thin - film material growth solutions centered around lead zirconate titanate (PZT) and scandium aluminum nitride (ScAlN). In addition, due to the unique properties of PZT materials in ferroelectricity, dielectricity, pyroelectricity, etc., the device can also provide technical development support for a variety of application directions such as ferroelectric random access memory, infrared detectors, and temperature sensors.Performance: The device has 7 chambers, with a transfer chamber in the middle, a loading chamber on the operation side, and 5 process chambers, enabling one - stop solutions for piezoelectric thin - film preparation. It can process 8 - inch wafers, with a capacity of 10 wafers per batch. It has 4 sputtering chambers, with a magnetic rotary cathode (upper side) for the cathode, a DC power of 10kW, and a water - cooled electrostatic chuck for the substrate electrode. The etching chamber has a power supply antenna of 1kW, a bias of 600W, and a water - cooled electrostatic chuck for the substrate electrode. The device's operation panel has an integrated control function, enabling automated vacuum and deposition processes.