LEYBOLD Z400 溅射系统用途：适用于科研及小规模生产场景，可在多种基底材料上进行薄膜沉积，常见于材料科学研究、电子器件制备等领域，如制备半导体薄膜、金属薄膜等。性能：该系统配备 4 个 75mm 的靶材，支持射频（RF）或直流（DC）溅射。最大可处理 2 英寸晶圆，搭载涡轮分子泵。基板加热器最高温度可达 850°C。配备 500W 的直流电源与 600W 的射频电源，还具备基板偏压功能，能够满足不同薄膜沉积工艺的需求。

Product Name: LEYBOLD Z400 sputtering systemPurpose: It is suitable for scientific research and small - scale production scenarios. It can deposit thin films on a variety of substrate materials and is commonly used in fields such as materials science research and electronic device fabrication, such as the preparation of semiconductor films and metal films.Performance: The system is equipped with 4 targets of 75mm, supporting RF or DC sputtering. It can handle wafers up to 2 inches in size and is equipped with a turbomolecular pump. The substrate heater can reach a maximum temperature of 850°C. It is equipped with a 500W DC power supply and a 600W RF power supply, and also has a substrate biasing function, which can meet the requirements of different thin - film deposition processes.