DENTON VACUUM DV 602 磁控溅射镀膜系统用途：适用于科研与工业领域，在半导体、光学、材料等行业中，可在各类基底上沉积多种薄膜。如在半导体芯片制造中沉积金属电极薄膜，在光学镜片生产中制备功能薄膜，在材料研究中探索新型薄膜材料 。性能：有两个 3 英寸阴极和一个 4 英寸阴极，可由射频（RF）或直流（DC）电源驱动。配备机械泵和低温泵，能将真空度抽至 10⁻⁷托以下。极限真空优于 5×10⁻⁷托，6 英寸衬底镀膜均匀性优于 ±3%，重复性优于 ±2.0%。具备 3 个 3 英寸靶位，2 个 DC 源和 1 个 RF 源，支持 6 英寸以下不同尺寸基片。可进行多层薄膜溅射、多靶共溅射、反应溅射，能溅射沉积金、镍、铝、锗、钛、铂等金属及二氧化硅、ITO 等相关复合膜 。

Product Name: DENTON VACUUM DV 602 Magnetron Sputtering Coating SystemPurpose: It is suitable for scientific research and industrial fields. In industries such as semiconductors, optics, and materials, it can deposit a variety of thin films on various substrates. For example, it can deposit metal electrode thin films in semiconductor chip manufacturing, prepare functional thin films in optical lens production, and explore new thin - film materials in materials research.Performance: It has two 3 - inch cathodes and one 4 - inch cathode, which can be driven by radio - frequency (RF) or direct - current (DC) power sources. It is equipped with a mechanical pump and a cryo pump, and can pump the vacuum degree below 10⁻⁷ Torr. The ultimate vacuum is better than 5×10⁻⁷ Torr. The film - coating uniformity on a 6 - inch substrate is better than ±3%, and the repeatability is better than ±2.0%. It has three 3 - inch target positions, two DC sources and one RF source, and supports substrate sizes below 6 inches. It can perform multi - layer film sputtering, multi - target co - sputtering, and reactive sputtering, and can sputter and deposit metals such as gold, nickel, aluminum, germanium, titanium, platinum, as well as related composite films such as silicon dioxide and ITO.