ANELVA C - 7300 溅射设备用途：常用于半导体制造领域，可在晶圆等基底材料上进行薄膜沉积。尤其适用于化合物半导体（如砷化镓、氮化镓）的金属电极沉积，也能满足功率 IC、MEMS 等工艺中对薄膜的需求 。性能：具备良好的膜厚均匀性，膜特性变化小。采用先进溅射技术，能实现高沉积速率，且可保障沉积表面的高平坦度。可进行高 Aspect Ratio（深宽比）的均匀沉积，有助于复杂结构的薄膜制备 。

Product Name: ANELVA C - 7300 Sputtering EquipmentPurpose: It is often used in the semiconductor manufacturing field and can deposit thin films on substrate materials such as wafers. It is especially suitable for the deposition of metal electrodes in compound semiconductors (such as gallium arsenide and gallium nitride), and can also meet the requirements for thin films in processes such as power ICs and MEMS.Performance: It has good film thickness uniformity and small film property changes. Using advanced sputtering technology, it can achieve a high deposition rate and ensure a high flatness of the deposition surface. It can perform uniform deposition with a high Aspect Ratio, which is helpful for the preparation of thin films with complex structures.