爱发科 ULVAC CERAUS ZI 1000用途：这是一款高性价比的金属化系统，主要用于多层布线应用。可适用于高定向阻挡金属溅射、铝流溅射和铜流技术等工艺，能为半导体芯片等器件提供金属化薄膜沉积，满足其电路连接等功能需求，是金属化需求的高效解决方案10。性能：通过优化各种工艺配置，具备较高的生产效率。可实现对多种材料的溅射沉积，包括金属、氧化物、氮化物等。能够精确控制溅射过程，保证薄膜沉积的均匀性和一致性，有助于提高产品质量和生产良率，为大规模生产提供稳定可靠的工艺保障9。

Product Name: ULVAC CERAUS ZI 1000Purpose: This is a high - cost - performance metalization system, mainly used for multi - layer wiring applications. It is suitable for processes such as high - directional barrier metal sputtering, aluminum flow sputtering, and copper flow technology. It can provide metalization film deposition for semiconductor chips and other devices, meeting the functional requirements such as circuit connection, and is an efficient solution for metalization needs10.Performance: Through optimizing various process configurations, it has high production efficiency. It can realize the sputtering deposition of various materials, including metals, oxides, nitrides, etc. It can precisely control the sputtering process to ensure the uniformity and consistency of film deposition, which helps to improve product quality and production yield, providing a stable and reliable process guarantee for large - scale production9.