爱发科 ULVAC Entron EX W300用途：这是一款专为 300mm 半导体市场打造的多腔溅射系统。广泛应用于铝、铜、高熔点金属布线工序，适用于 NVM、铝铜布线、钛 / 氮化钛阻挡金属、厚铝及钴 / 镍硅化物等工艺。不仅能用于硅基器件，在化合物半导体工艺方面也有出色表现。可搭载用于形成高密度且膜压可控氮化钛膜的 “ULTiNA” 溅射模组，其制成的氮化钛膜可作硬掩膜，应用于 5 纳米乃至 3 纳米逻辑半导体生产 。性能：最多可安装 10 个工艺模块（包括 PVD、CVD、ALD 等），另加脱气、冷却等功能模块。有单一型（S 型）和串联型（T 型）平台可选，适配不同生产规模需求。配备新型搬运机器人，机械吞吐量可达 100wph 或更高。采用高度可靠的 Rorze EFEM 进行大气传输，搭配符合下一代半导体工厂标准的最新控制系统 。

Product Name: ULVAC Entron EX W300Purpose: This is a multi - chamber sputtering system specifically designed for the 300 - mm semiconductor market. It is widely used in aluminum, copper, and refractory metal wiring processes, suitable for processes such as NVM, Al & Cu wiring, Ti/TiN barrier metal, thick Al, and Co/Ni salicide. It can be applied not only to silicon - based devices but also shows excellent performance in compound semiconductor processes. It can be equipped with the "ULTiNA" sputtering module for forming high - density and film - pressure - controllable titanium nitride films. The titanium nitride films made can be used as hard masks and applied in the production of 5 - nanometer and even 3 - nanometer logic semiconductors.Performance: Up to 10 process modules (including PVD, CVD, ALD, etc.) can be installed, plus functional modules such as degassing and cooling. There are single - type (S - type) and tandem - type (T - type) platforms available to meet different production scale requirements. Equipped with a new transfer robot, the mechanical throughput can reach 100 wafers per hour (wph) or higher. It uses a highly reliable Rorze EFEM for atmospheric transfer and is equipped with the latest control system that meets the standards of the next - generation semiconductor factory.