爱发科 ULVAC SME - 200E用途：是一款集群式溅射系统，适用于研发和生产场景。可用于化合物半导体、声表面波（SAW）器件的制造，在制造栅电极、电容器、电阻以及 SAW 器件的电极层等生产流程中发挥作用。性能：能处理最大直径达 200mm（约 8 英寸）的基板。最多可配备三个工艺腔室，支持多种特定应用的工艺模块。具备基板加热机制，可进行同时沉积与旋转沉积。系统配置灵活，其中一个工艺腔室可设为溅射腔，另一个用于等离子处理，第三个用于加热步骤。还可选配旋转磁控型阴极用于溅射、高密度型等离子源用于蚀刻，以及最高 300 摄氏度的高温加热单元 。

Product Name: ULVAC SME - 200EPurpose: It is a cluster - type sputtering system, suitable for R & D and production scenarios. It can be used in the manufacturing of compound semiconductors and surface - acoustic wave (SAW) devices, and plays a role in production processes such as manufacturing gate electrodes, capacitors, resistors, and electrode layers of SAW devices.Performance: It can handle substrates with a maximum diameter of 200mm (about 8 inches). Up to three process chambers can be equipped, and it supports a variety of application - specific process modules. It has a substrate heating mechanism and can perform simultaneous deposition and revolved deposition. The system has a flexible configuration. One of the process chambers can be set as a sputtering chamber, another for plasma processing, and the third for heating steps. Options also include a rotary magnet - type cathode for sputtering, a high - density type plasma source for etching, and a high - temperature heating unit up to 300 °C.