爱发科 ULVAC SDP - 570用途：这是一款溅射设备，在半导体、光学等领域发挥重要作用。在半导体制造中，可用于芯片相关薄膜的溅射沉积，助力芯片制造工艺。在光学行业，适用于光学镜片等各类光学元件薄膜的制备，如增透膜、反射膜等。也可用于光电器件如波导、放大器、光开关等的生产制作 。性能：可处理的基板尺寸范围为 φ125 至 200mm，能实现厚度达 50μm 的超薄硅晶圆自动传送。采用爱发科独创的 NLD（中性环放电）等离子源，具备低工艺压力、高密度等离子体、低电子温度的特性，非常适合石英玻璃、派热克斯玻璃等材料的相关工艺。其蚀刻系统能在低压下消除蚀刻底部的 “草状” 或 “针状” 缺陷，高密度等离子体可提高深蚀刻速率。配备的冷却器温度可在 - 20°C 至 40°C 之间调节 。

Product Name: ULVAC SDP - 570Purpose: This is a sputtering device that plays an important role in the semiconductor and optical fields. In semiconductor manufacturing, it can be used for the sputter deposition of chip - related thin films, facilitating chip manufacturing processes. In the optical industry, it is suitable for the preparation of thin films on various optical components such as optical lenses, such as anti - reflection coatings and reflective coatings. It can also be used in the production of optoelectronic devices such as waveguides, amplifiers, and optical switches.Performance: The applicable substrate size ranges from φ125 to 200mm, and it can achieve automatic transfer of ultra - thin silicon wafers with a thickness of up to 50μm. It adopts ULVAC's original NLD (Neutral Loop Discharge) plasma source, featuring low process pressure, high - density plasma, and low electron temperature, which is very suitable for related processes of materials such as quartz glass and Pyrex glass. Its etching system can eliminate "grass - like" or "needle - like" defects at the bottom of the etching under low pressure, and the high - density plasma can increase the deep etching rate. The equipped chiller temperature can be adjusted between - 20°C and 40°C.