东京电子 TEL/TOKYO ELECTRON MBB 系列溅射设备用途：适用于薄膜、研发以及半导体 / 电子行业。可在玻璃、硅片、光刻胶和塑料等各类基板上沉积超薄膜，常用于制造集成电路、电子元件等，满足不同行业对薄膜沉积的高精度需求。性能：以 MBB 830 为例，采用多靶、多源溅射系统，沉积速率比传统溅射系统快约 10 倍。配备集成真空密封腔室，在低压惰性气体环境下稳定控制溅射过程。拥有超高精度平台，可进行多层膜生长等复杂操作，带有抗静电基板减少静电影响。能使用多种溅射靶材，如金属、合金和氧化物等，制备出厚度从几纳米到几百纳米的薄膜，并具备自动调整和优化功能，可通过改变溅射速率、温度或压力定制薄膜材料成分 。

Product Name: TEL/TOKYO ELECTRON MBB Series Sputtering EquipmentPurpose: Suitable for thin - film, R & D, and semiconductor/electronics industries. It can deposit ultra - thin films on various substrates such as glass, silicon wafers, photoresists, and plastics. It is often used in the manufacturing of integrated circuits and electronic components, meeting the high - precision requirements for thin - film deposition in different industries.Performance: Taking MBB 830 as an example, it adopts a multi - target, multi - source sputtering system, and the deposition rate is about 10 times faster than that of traditional sputtering systems. Equipped with an integrated vacuum - sealed chamber, it stably controls the sputtering process in a low - pressure inert gas environment. It has an ultra - high - precision platform that can perform complex operations such as multi - layer film growth and is equipped with an anti - static substrate to reduce electrostatic influence. It can use a variety of sputtering target materials, such as metals, alloys, and oxides, to prepare films with a thickness ranging from a few nanometers to several hundred nanometers, and has automatic adjustment and optimization functions. The material composition of the films can be customized by changing the sputtering rate, temperature, or pressure.