ULTECH EasyDEP - 3 热蒸发系统用途：主要用于材料的金属化处理，适用于半导体元件、MEMS、NANO 电子元件、激光 / 光元件以及信息通信元件等制造领域，也常用于研究所及学校的 R&D 工作。可在 4 英寸晶圆等基板上蒸镀金（Au）、铬（Cr）、镍（Ni）、钛（Ti）、铜（Cu）、铝（Al）等材料 。性能：基板尺寸为 4 英寸晶圆，单次运行最多可处理 3 片 4 英寸晶圆。配备功率为 2kW 的热电源，输出电压 0 - 5V，输出电流 0 - 300A，电流调节精度为满量程的 ±2%。厚度控制器分辨率达 0.0013A，速率分辨率为 0.133Å/sec，基频 6MHz。真空系统采用大阪真空 TG450F 涡轮泵（抽速 450L/sec @N₂ ）和 KODIVAC GHP550 旋片泵（抽速 650L/min），极限压力≤7.0×10⁻⁷Torr 。

Product Name: ULTECH EasyDEP - 3 Thermal Evaporation SystemPurpose: It is mainly used for the metallization of materials and is suitable for the manufacturing fields of semiconductor components, MEMS, NANO electronic components, laser/optical components, and information and communication components. It is also commonly used in R & D work in research institutes and schools. Materials such as gold (Au), chromium (Cr), nickel (Ni), titanium (Ti), copper (Cu), and aluminum (Al) can be evaporated on substrates such as 4 - inch wafers.Performance: The substrate size is 4 - inch wafers, and a maximum of 3 4 - inch wafers can be processed per run. It is equipped with a thermal power supply with a power of 2kW, an output voltage of 0 - 5V, an output current of 0 - 300A, and the current regulation accuracy is ±2% of the full scale. The thickness controller has a resolution of 0.0013A, a rate resolution of 0.133Å/sec, and a fundamental frequency of 6MHz. The vacuum system uses an Osaka Vacuum TG450F turbo pump (pumping speed 450L/sec @N₂) and a KODIVAC GHP550 rotary pump (pumping speed 650L/min), with an ultimate pressure ≤7.0×10⁻⁷Torr.