爱发科 ULVAC EI-7K用途：这是一款批次型高真空蒸发系统，用于在基板上沉积金属及氧化物薄膜。适用于研发到小规模生产场景，支持电子束（EB）、电阻加热（RH）等多种蒸发源。适配直径 2-6 英寸圆形基板、矩形基板，以及硅、化合物、玻璃、陶瓷等材质，广泛应用于半导体、光学、材料研究等领域。性能：可配置剥离工艺、行星式、卫星式等多种基板支架。通过 LCD 触摸面板操作，搭载高性能 PC 操作系统，具备配方管理、数据记录和维护辅助功能。虽无公开详细参数，但能稳定实现自动化真空控制与薄膜沉积流程，满足多样化薄膜制备的精度需求。

Product Name: ULVAC EI-7KPurpose: This is a batch-type high-vacuum evaporation system used for depositing metal and oxide thin films on substrates. Suitable for R&D to small-scale production scenarios, it supports various evaporation sources such as electron beam (EB) and resistance heating (RH). Compatible with 2-6 inch diameter circular substrates, rectangular substrates, and materials like silicon, compounds, glass and ceramics, widely used in semiconductors, optics, materials research and other fields.Performance: Configurable with various substrate holders including lift-off, planetary and satellite types. Operated via LCD touch panel, equipped with high-performance PC operating system, featuring recipe management, data logging and maintenance assistance functions. Though no detailed parameters are public, it stably realizes automated vacuum control and thin-film deposition processes, meeting precision requirements for diverse thin-film preparation.