SFI/SPUTTERED FILMS INC Endeavor 8600 溅射系统用途：这是一款用于工业和科研的中型溅射设备。可在半导体、光学等领域进行薄膜制备，如在半导体制造中为芯片溅射金属或介质薄膜；在光学行业为镜片制备增透、反射薄膜，优化光学元件性能。性能：支持 6 英寸晶圆，可升级至 8 英寸。配备至多 6 个溅射源，能同时进行 8 种材料配置。有独立控制的双靶结构，适用于金属氧化物等反应溅射薄膜制备。采用直流或交流溅射模式，具备独立靶材控制。能处理最大 200mm 的基板，最高加工温度达 500°C。拥有皮费尔 tph 180c h 涡轮分子泵，可选配前级泵以提高处理量。其传输快门单元可控制薄膜生长速率，内置的微处理器可监测和存储工艺数据 。

Product Name: SFI/SPUTTERED FILMS INC Endeavor 8600 Sputtering SystemPurpose: This is a mid - sized sputtering equipment for industrial and research applications. It can be used for thin - film preparation in fields such as semiconductors and optics. For example, in semiconductor manufacturing, it can sputter metal or dielectric films for chips; in the optical industry, it can prepare anti - reflection and reflective films for lenses to optimize the performance of optical components.Performance: It supports 6 - inch wafers and can be upgraded to 8 - inch. It is equipped with up to 6 sputter sources and can perform 8 material configurations simultaneously. It has a dual - target structure with independent control, which is suitable for the preparation of reactive sputtered films such as metal oxides. It adopts DC or AC sputtering modes with independent target control. It can handle substrates up to 200mm and has a maximum processing temperature of 500°C. It is equipped with a Pfeiffer tph 180c h turbomolecular pump, and an optional backing pump can be selected to increase throughput. Its transmission shutter unit can control the film growth rate, and the built - in microprocessor can monitor and store process data.