芝浦机电 SHIBAURA SWN5000 溅射设备用途：这是一款优化用于功率器件背面电极涂覆、凸块下金属层涂覆及多层膜涂覆的设备。适用于半导体制造领域，可在功率器件、芯片等元件上进行相关涂覆作业，助力提升器件性能 。性能：可处理 200mm、150mm、100mm 尺寸晶圆，也能处理厚度约 100μm 的薄晶圆。拥有至多 5 个工艺腔室（至多 10 把溅射枪）。具备晶圆温度控制功能（通过 esc）。设备占地面积小，尺寸为宽 2800× 深 3600× 高 2500（mm）。具备加热及反向溅射功能 。

Product Name: SHIBAURA SWN5000 Sputtering EquipmentPurpose: This is an optimized equipment for back - side electrode coating on power devices, under bump metals coating, and multi - layer film coating. It is suitable for the semiconductor manufacturing field and can perform relevant coating operations on components such as power devices and chips, helping to improve device performance.Performance: It can process wafers with sizes of 200mm, 150mm, and 100mm, as well as thin wafers with a thickness of about 100μm. It has a maximum of 5 process chambers (a maximum of 10 sputtering guns). It has a wafer temperature control function (through esc). The equipment has a small footprint with dimensions of width 2800×depth 3600×height 2500 (mm). It has heating and reverse sputtering functions.