ANELVA L - 322S - FHT 磁控溅射设备用途：常用于半导体制造、材料研究等领域。在半导体制造中，可用于芯片制造过程里的薄膜沉积，比如形成金属互连层等；材料研究方面，助力新型材料薄膜的制备与性能探索 。性能：配备三个直径 3 英寸的平面磁控阴极，方便进行多层镀膜，设有靶材快门和预溅射快门。拥有可旋转的基片支架，有助于提升薄膜在基片上的附着力。该系统溅射腔室在氩气环境下，极限压力可达 2x10⁻⁵Pa 。

Product Name: ANELVA L - 322S - FHT Magnetron Sputtering EquipmentPurpose: It is often used in fields such as semiconductor manufacturing and materials research. In semiconductor manufacturing, it can be used for thin film deposition during chip manufacturing, such as forming metal interconnect layers. In materials research, it helps with the preparation and performance exploration of new material thin films.Performance: It is equipped with three 3 - inch - diameter planar magnetron cathodes to facilitate multi - layer coating, and is equipped with a target shutter and a pre - sputtering shutter. It has a rotatable substrate holder, which helps improve the adhesion of the thin film to the substrate. The ultimate pressure in the sputtering chamber of this system in an argon gas environment can reach 2x10⁻⁵Pa.