https://rc0.zihu.com/g5/M00/41/1A/CgAGbGie_7eAPCeZAAKLhgD_63c64.jpeg,https://rc0.zihu.com/g5/M00/41/1A/CgAGbGie_7qAVf0MAAM_7IYnAzw64.jpeg,https://rc0.zihu.com/g5/M00/41/1A/CgAGbGie_7uAJXpVAAI89pNV9UI55.jpeg,https://rc0.zihu.com/g5/M00/41/1A/CgAGbGie_7uADl-UAAJSZMZfcEw71.jpeg
https://rc0.zihu.com/g5/M00/41/1A/CgAGbGie_7eAPCeZAAKLhgD_63c64.jpeg
QUORUM TECH / BIO-RAD / POLARON E5400 离子溅射仪

库存状态:现货

QUORUM TECH / BIO - RAD / POLARON E5400 溅射镀膜仪用途:主要用于扫描电镜(SEM)样品制备。为各类不导电或导电性差的样品表面镀上一层超薄金属膜,以减少电子束照射时产生的电荷积累,提升成像质量,便于更清晰地观察样品微观结构。适用于材料科学、生物学、地质学等众多领域的微观分析工作。比如在材料科学中对纳米材料进行镀膜处理以观察其精细结构;在生物学里,为生物组织切片镀膜从而研究细胞形态等 。性能:输入电压为 115V ,拥有 4 英寸的工作腔室。可搭载直径 40mm、厚度 0.1mm 的溅射靶材(如金靶等),靶材安装于铝背板上。设备的主体机柜内集成了高压电源、真空歧管和测量装置。工作腔室位于机柜顶部,可进行抽真空操作。玻璃工作腔室上方的顶板组件装有用于溅射的靶材以及磁偏转系统,以此精确控制溅射过程,实现均匀镀膜 。

Product Name: QUORUM TECH / BIO - RAD / POLARON E5400 Sputter CoaterPurpose: It is mainly used for the preparation of scanning electron microscope (SEM) samples. It deposits an ultra - thin metal film on the surface of various non - conductive or poorly conductive samples to reduce charge accumulation generated during electron beam irradiation, improve imaging quality, and facilitate clearer observation of the sample's microstructure. It is applicable to micro - analysis work in many fields such as materials science, biology, and geology. For example, in materials science, it coats nanomaterials to observe their fine structures; in biology, it coats biological tissue sections to study cell morphology, etc.Performance: The input voltage is 115V, and it has a 4 - inch working chamber. It can carry sputtering targets (such as gold targets) with a diameter of 40mm and a thickness of 0.1mm, which are installed on an aluminum backplate. The main cabinet of the equipment integrates a high - voltage power supply, a vacuum manifold, and a measuring device. The working chamber is located on the top of the cabinet and can be evacuated. The top - plate assembly above the glass working chamber is equipped with the target material for sputtering and a magnetic deflection system to precisely control the sputtering process and achieve uniform coating.

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