MRC 603 II 溅射系统用途：这是一款用于材料表面薄膜沉积的设备，在半导体、光学、电子等领域应用广泛。例如，在半导体制造中，可在晶圆上溅射金属或绝缘薄膜，用于芯片电路连接与绝缘；在光学行业，能够为镜片镀制增透、反射等功能薄膜，提升光学元件性能。性能：采用直流溅射系统，具备 3 个靶位，可同时处理多种材料进行溅射沉积。设备经改造可用于射频介质沉积，搭配射频电子控制台。能在 4 英寸、6 英寸、8 英寸和 12 英寸方形基板上作业，还拥有预蚀刻功能，可对基板表面进行预处理，提高薄膜附着力 。

Product Name: MRC 603 II Sputtering SystemPurpose: This is a device used for thin - film deposition on material surfaces and is widely applied in fields such as semiconductors, optics, and electronics. For example, in semiconductor manufacturing, it can sputter metal or insulating films on wafers for chip circuit connection and insulation. In the optical industry, it can coat anti - reflection, reflective and other functional films on lenses to improve the performance of optical components.Performance: It adopts a DC sputtering system with 3 target positions, which can simultaneously process multiple materials for sputtering deposition. The equipment has been modified for RF dielectric deposition and is equipped with an RF electronics console. It can operate on 4 - inch, 6 - inch, 8 - inch, and 12 - inch square substrates and also has a pre - etch function, which can pre - treat the substrate surface to improve film adhesion.