EVATEC Radiance BPM1 溅射设备用途：常用于先进封装和功率电子器件的生产。可在 GaN、Si 上 GaN 和 SiC 上 GaN 等材料表面，进行电流散布层、反射层、接触层等薄膜的溅镀 ，满足半导体制造、光学镀膜等领域需求。性能：由 1500W 直流电源供电，能实现特定的溅射速率。运用专利的磁平衡束技术，具备出色的稳定性和工艺重复性，可实现卓越的薄膜均匀性与优良的薄膜性能。支持反应气体集成，内置气体流量控制装置，为先进工艺提供可重复的气体环境 。

Product Name: EVATEC Radiance BPM1 Sputtering EquipmentPurpose: It is often used in the production of advanced packaging and power electronic devices. It can sputter thin films such as current spreading layers, reflective layers, and contact layers on materials like GaN, GaN on Si, and GaN on SiC, meeting the needs of fields such as semiconductor manufacturing and optical coating.Performance: Powered by a 1500W DC power supply, it can achieve a specific sputter rate. Using patented magnetic balanced beam technology, it has excellent stability and process repeatability, enabling excellent film uniformity and good film properties. It supports the integration of reactive gases and has a built-in gas flow control device to provide a repeatable gas environment for advanced processes.