EVATEC Radiance 溅射设备用途：适用于半导体制造、光学镀膜及先进封装等领域。可在各类晶圆及基底材料上，进行电流散布层、反射层、接触层等薄膜的溅镀，例如在 GaN、Si 上 GaN 和 SiC 上 GaN 等材料表面制备薄膜 。性能：采用专利的磁平衡束技术，能实现卓越的薄膜均匀性与优良的薄膜性能。具备强大的工艺控制能力，可有效模拟物理气相沉积（PVD）条件。支持反应气体集成，并设有内置气体流量控制装置，为先进工艺提供可重复的气体环境。不同型号（如 Radiance BPM1 等）在功率、靶材类型等方面有差异，如 Radiance BPM1 由 1500W 直流电源供电，可实现特定的溅射速率 。

Product Name: EVATEC Radiance Sputtering EquipmentPurpose: It is suitable for fields such as semiconductor manufacturing, optical coating, and advanced packaging. It can sputter thin films such as current spreading layers, reflective layers, and contact layers on various wafers and substrate materials. For example, it can prepare thin films on the surfaces of materials such as GaN, GaN on Si, and GaN on SiC.Performance: It adopts patented magnetic balanced beam technology, which can achieve excellent film uniformity and good film properties. It has strong process control capabilities and can effectively simulate physical vapor deposition (PVD) conditions. It supports the integration of reactive gases and is equipped with a built - in gas flow control device to provide a repeatable gas environment for advanced processes. Different models (such as Radiance BPM1, etc.) have differences in power, target types, etc. For example, Radiance BPM1 is powered by a 1500W DC power supply and can achieve specific sputter rates.