巴尔查斯 BALZERS BAS 450 PM 物理气相沉积溅射系统用途：适用于半导体、光学、材料研究等领域。可在各类基底上精准沉积金属、合金、化合物等薄膜，用于制造半导体芯片的电极薄膜、光学镜片的功能性薄膜，助力材料研究中的薄膜实验 。性能：配备低温泵与直流磁控管。沉积时，基板温度约 50°C 。氩气入口靠近硅靶，氮气入口靠近基板。基板在沉积过程中旋转，以确保薄膜性能可控且均匀，薄膜沉积速率约为每转 1 埃，即 30 埃 / 分钟 。可同时对多个 3 英寸圆形（或其他不同形状）基板进行镀膜。设备基础压力为1×10−3Pa，氩氮混合气体总压 0.5Pa 。

Product Name: BALZERS BAS 450 PM Physical Vapor Deposition Sputtering SystemPurpose: It is suitable for fields such as semiconductors, optics, and materials research. It can accurately deposit thin films of metals, alloys, compounds, etc. on various substrates, used for manufacturing electrode thin films for semiconductor chips, functional thin films for optical lenses, and assisting in thin film experiments in materials research.Performance: It is equipped with a cryopump and a DC magnetron. During deposition, the substrate temperature is approximately 50°C. The argon inlet is close to the silicon target, and the nitrogen inlet is close to the substrate. The substrate rotates during deposition to ensure controllable and uniform film properties. The film deposition rate is about 1 angstrom per revolution, that is, 30 angstroms/minute. Multiple 3-inch round (or other different-shaped) substrates can be coated simultaneously. The base pressure of the equipment is 1×10−3Pa, and the total pressure of the argon-nitrogen gas mixture is 0.5Pa.