TRIKON PLASMAFAB MS4200用途：这是一款等离子体刻蚀系统，主要应用于半导体制造领域，适用于硅基芯片、化合物半导体器件的刻蚀工艺。可用于刻蚀硅、二氧化硅、氮化硅等材料，支持接触孔、金属布线等关键制程，满足高精度图形转移需求。性能：兼容 200mm（8 英寸）晶圆，采用模块化设计，可配置多个刻蚀腔室。刻蚀速率均匀性≤±3%（全片），具备纳米级刻蚀精度。配备先进的等离子体源，离子密度可达 10¹¹-10¹² ions/cm³，射频功率 0-600W 可调。真空系统极限压力≤5×10⁻⁸ Torr，工艺压力控制范围 1-1000mTorr。

Product Name: TRIKON PLASMAFAB MS4200Purpose: This is a plasma etching system mainly used in the semiconductor manufacturing field, suitable for etching processes of silicon-based chips and compound semiconductor devices. It can etch materials such as silicon, silicon dioxide and silicon nitride, supporting key processes like contact holes and metal wiring, meeting high-precision pattern transfer requirements.Performance: Compatible with 200mm (8-inch) wafers, adopting modular design that can configure multiple etching chambers. Etching rate uniformity ≤±3% (full wafer) with nanoscale etching precision. Equipped with advanced plasma source, ion density up to 10¹¹-10¹² ions/cm³, RF power adjustable from 0-600W. Vacuum system ultimate pressure ≤5×10⁻⁸ Torr, process pressure control range 1-1000mTorr.