ANELVA SPF - 730H 磁控溅射设备用途：适用于材料研究、半导体制造等领域。在材料研究中，用于制备新型材料薄膜，探索材料特性；半导体制造方面，可进行芯片制造过程中的薄膜沉积工艺 。性能：采用磁控溅射技术，具备 8 英寸靶材。可通过直流（D.C.）电源进行溅射，如直流功率可达 1.0kW 。溅射气体可选用 Ar、Ar + N₂（20%）、Ar + N₂（30%）等，气体压力范围在 1 - 12Pa 。基片温度能控制在 70°C ，以满足不同工艺对温度的需求 。

Product Name: ANELVA SPF - 730H Magnetron Sputtering EquipmentPurpose: It is suitable for fields such as materials research and semiconductor manufacturing. In materials research, it is used to prepare new material thin films and explore material properties. In semiconductor manufacturing, it can be used for thin film deposition processes during chip manufacturing.Performance: It adopts magnetron sputtering technology and has an 8 - inch target. It can be sputtered through a direct - current (D.C.) power supply, for example, the D.C. power can reach 1.0kW. The sputtering gas can be selected from Ar, Ar + N₂ (20%), Ar + N₂ (30%), etc., and the gas pressure range is 1 - 12Pa. The substrate temperature can be controlled at 70°C to meet the temperature requirements of different processes.