MRC 8667A 射频磁控溅射系统用途：主要用于薄膜制备，可通过溅射工艺在各类基材表面形成特定性能的薄膜，适用于半导体、光学等领域，如制备半导体芯片的导电薄膜、光学镜片的增透膜等。性能：溅射压力范围为 5 - 50 毫托，射频功率范围是 150W - 1000W。通过调整参数，可生产出具有所需密度、形态和附着力的薄膜。例如，当氩气压力为 20 毫托、射频功率为 900W 时，能满足特定薄膜的制备要求，为薄膜制备提供了较为灵活的参数调节空间。

Product Name: MRC 8667A RF Magnetron Sputtering SystemPurpose: It is mainly used for thin - film preparation. It can form thin - films with specific properties on the surface of various substrates through the sputtering process, and is suitable for semiconductor, optical and other fields, such as preparing conductive films for semiconductor chips and anti - reflection films for optical lenses.Performance: The sputtering pressure range is 5 - 50 mTorr, and the RF power range is 150W - 1000W. By adjusting the parameters, thin - films with the required density, morphology and adhesion can be produced. For example, when the argon pressure is 20 mTorr and the RF power is 900W, it can meet the preparation requirements of specific thin - films, providing a relatively flexible parameter adjustment space for thin - film preparation.