巴尔查斯 BALZERS LLS 802 物理气相沉积（PVD）溅射系统用途：适用于科研机构以及小批量生产场景，可在半导体、光学、材料研究等领域，于各类基底材料上沉积金属、合金、化合物等薄膜，例如制备半导体芯片的电极薄膜、光学镜片的增透薄膜 。性能：制造于 1994 年。运行电压为 3 x 400 / 230 vac 3p+n+e（配备变压器），额定电流 60A，频率 60Hz 。对工作环境条件有一定要求，水压需保持在 4 - 7 bar，气压 6 - 8 bar，氮气常规压力 2.5 - 5.0 bar，氮气工艺压力 0.5 - 1.0 bar，氮气排气压力 0.2 - 0.5 bar，氩气压力 0.5 - 1.0 bar 。

Product Name: BALZERS LLS 802 Physical Vapor Deposition (PVD) Sputtering SystemPurpose: It is suitable for research institutions and small - batch production scenarios. In fields such as semiconductors, optics, and materials research, it can deposit thin films of metals, alloys, compounds, etc. on various substrate materials, for example, preparing electrode thin films for semiconductor chips and anti - reflection thin films for optical lenses.Performance: Manufactured in 1994. The operating voltage is 3 x 400 / 230 vac 3p+n+e (transformer supplied), the rated current is 60A, and the frequency is 60Hz. It has certain requirements for the working environment conditions. The water pressure needs to be maintained at 4 - 7 bar, the air pressure at 6 - 8 bar, the normal nitrogen pressure at 2.5 - 5.0 bar, the nitrogen process pressure at 0.5 - 1.0 bar, the nitrogen vent pressure at 0.2 - 0.5 bar, and the argon pressure at 0.5 - 1.0 bar.