日立HITACHI E-1010离子溅射仪用途：适用于多种材料的薄膜沉积，可在玻璃、石英、硅及金属等基板上操作，常用于精密微电子学、光电子学、纳米技术和材料科学等研究领域。在显微镜检查前，能为非导电样品表面喷镀一层2-15nm的贵金属（如金、铂或合金），减轻二次电子观察时的电荷积累，提升图像质量。性能：具备两级压力控制系统，由外部真空室和内部压力室组成，可减少污染及防止沉积时的除气问题。配备电子电流测量装置，精确控制沉积速率与监测成分。拥有远程监测工具，可实时监控沉积过程中的压力、温度等参数。最大可处理直径50mm的样品，喷镀靶材多样，还带有喷碳附件。最大溅射速率达0.25对/分钟，最大沉积速率为8nm/min 。 

Product Name: Hitachi HITACHI E-1010 Ion Sputtering CoaterPurpose: It is suitable for thin film deposition of various materials and can be operated on substrates such as glass, quartz, silicon and metal. It is often used in research fields such as precision microelectronics, optoelectronics, nanotechnology and materials science. Before microscopic examination, it can spray a 2 - 15nm layer of precious metal (such as gold, platinum or alloy) on the surface of non-conductive samples, reducing charge accumulation during secondary electron observation and improving image quality.Performance: It has a two-stage pressure control system composed of an external vacuum chamber and an internal pressure chamber, which can reduce contamination and prevent outgassing problems during deposition. It is equipped with an electron current measurement device to accurately control the deposition rate and monitor the composition. It has a remote monitoring tool that can real-time monitor parameters such as pressure and temperature during the deposition process. It can handle samples with a maximum diameter of 50mm, has a variety of sputtering targets, and is also equipped with a carbon spraying attachment. The maximum sputtering rate reaches 0.25 pairs/minute, and the maximum deposition rate is 8nm/min.