阿斯迈 ASM EAGLE-12 等离子增强化学气相沉积（PECVD）系统用途：常用于半导体制造领域，主要用于在晶圆表面沉积薄膜电介质层。尤其适用于逻辑和存储生产线，在 DRAM 制造中被广泛应用，可通过沉积特定薄膜来满足芯片制造工艺需求 。性能：采用单晶圆腔室设计，能确保出色的工艺控制，实现卓越的薄膜均匀性，提升晶圆良品率。独特的腔室构造可使设备长时间稳定运行，运行成本低。可处理 300mm 晶圆。以 p - TEOS 工艺为例，气体流量如 Ar（7000sccm、500sccm）、He（2000sccm）、N₂（5000sccm）、NF₃（3000sccm）、O₂（3000sccm）、TEOS（300sccm）；射频功率方面，RPU 为 400kHz/3000W、HRF 为 13.56MHz/1000W、LRF 为 430kHz/1000W 。

Product Name: ASM EAGLE-12 Plasma Enhanced Chemical Vapor Deposition (PECVD) SystemPurpose: It is often used in the semiconductor manufacturing field, mainly for depositing thin film dielectric layers on the surface of wafers. It is especially suitable for logic and memory production lines and is widely used in DRAM manufacturing. It can meet the requirements of chip manufacturing processes by depositing specific thin films.Performance: It adopts a single-wafer chamber design, which can ensure excellent process control, achieve excellent film uniformity, and improve wafer yield. The unique chamber structure allows the equipment to operate stably for a long time with low operating costs. It can process 300mm wafers. Taking the p - TEOS process as an example, the gas flow rates are, for example, Ar (7000sccm, 500sccm), He (2000sccm), N₂ (5000sccm), NF₃ (3000sccm), O₂ (3000sccm), TEOS (300sccm); in terms of radio frequency power, RPU is 400kHz/3000W, HRF is 13.56MHz/1000W, and LRF is 430kHz/1000W.