https://rc0.zihu.com/g5/M00/41/28/CgAGbGiihs6ATvU3AANNV_vbgVs027.jpg,https://rc0.zihu.com/g5/M00/41/28/CgAGbGiihtKADHhaAAX0yO3Re4o572.jpg,https://rc0.zihu.com/g5/M00/41/28/CgAGbGiihtOAeh4-AAZYRjYyFs0147.jpg,https://rc0.zihu.com/g5/M00/41/28/CgAGbGiihtSAO3LkAAVt68iv3sA382.jpg
https://rc0.zihu.com/g5/M00/41/28/CgAGbGiihs6ATvU3AANNV_vbgVs027.jpg
泛林 LAM RESEARCH 201600-594-0001 干式刻蚀系统

库存状态:现货

泛林 LAM RESEARCH 201600 - 594 - 0001 设备用途:因暂未获取其详细用途,推测可能用于半导体制造环节,如刻蚀、薄膜沉积等,与泛林半导体其他产品类似,服务于芯片制造相关工艺。性能:同样因缺乏具体信息,参考同类型产品,该设备或许具备精准的工艺控制能力,能在半导体制造过程中,对相关工艺参数进行精确调控,保障工艺的稳定性和产品质量,如实现高精度的刻蚀尺寸控制或均匀的薄膜沉积厚度等,但具体参数暂无法明确。

Product Name: LAM RESEARCH 201600 - 594 - 0001 equipmentPurpose: Due to the lack of detailed information on its use, it is speculated that it may be used in semiconductor manufacturing processes such as etching and thin film deposition. Similar to other LAM Research semiconductor products, it serves chip manufacturing - related processes.Performance: Similarly, due to the lack of specific information, referring to similar products, this equipment may have precise process control capabilities. During semiconductor manufacturing, it can precisely regulate relevant process parameters to ensure process stability and product quality. For example, it can achieve high - precision etching size control or uniform thin - film deposition thickness, but specific parameters cannot be determined for the time being.

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