诺信 NORDSON XD 6600 XiDat X 射线检测系统用途：适用于电子制造领域，可对印刷电路板（PCB）组件、半导体封装等进行无损检测，能识别焊点缺陷、内部结构异常及元件偏移，助力质量控制与失效分析。技术原理：发射 X 射线穿透物体，因材料对 X 射线吸收程度不同，形成不同强度分布。探测器接收后转化为电信号，经处理生成图像，以此分析物体内部状况。性能：配备 100kV X 射线管，特征分辨率＜1.5μm。采用 100 万像素 CMOS 探测器，8 帧 / 秒实时成像。几何放大 1000 倍，系统放大 3000 倍。最大样品尺寸 508×406mm，支持 60° 倾斜与 360° 旋转检测，操作便捷。

Product Name: Nordson NORDSON XD 6600 XiDat X-ray Inspection SystemUsage: Suitable for electronics manufacturing, used for non-destructive inspection of PCB assemblies and semiconductor packages. It identifies solder defects, internal structure abnormalities and component shifts, aiding quality control and failure analysis.Technical Principle: Emits X-rays to penetrate objects. Due to different X-ray absorption by materials, varying intensity distributions form. Detectors receive and convert to electrical signals, processed into images for internal condition analysis.Performance: Equipped with 100kV X-ray tube, feature resolution ＜1.5μm. Uses 1-megapixel CMOS detector, 8fps real-time imaging. Geometric magnification 1000x, system magnification 3000x. Maximum sample size 508×406mm, supports 60° tilt and 360° rotation inspection, easy to operate.