是德科技 KEYSIGHT 5DX (5300) Series 3 X 射线检测系统用途：适用于电子制造中高密度 PCB 组件、半导体封装检测，可识别微焊点缺陷、BGA/CSP 空洞及多层结构异常，满足中高端产品质量管控需求。技术原理：通过多角度 X 射线发射，利用材料吸收差异，结合 3D 断层合成技术生成分层图像，智能算法消除层间干扰，实现内部结构精准分析。性能：配备 120kV X 射线管，焦点尺寸 6μm，空间分辨率＜1.2μm。200 万像素探测器，检测速度 280mm/s。最大样品尺寸 500×450mm，支持 65° 倾斜与 360° 旋转，AI 辅助分类，误报率＜0.6%。

Product Name: Keysight KEYSIGHT 5DX (5300) Series 3 X-ray Inspection SystemUsage: Suitable for inspecting high-density PCB assemblies and semiconductor packages in electronics manufacturing. Identifies micro solder defects, BGA/CSP voids and multi-layer structure abnormalities, meeting quality control needs of mid-to-high-end products.Technical Principle: Emits X-rays from multiple angles, uses material absorption differences, combines 3D tomosynthesis to generate layered images. Intelligent algorithms eliminate interlayer interference for accurate internal structure analysis.Performance: Equipped with 120kV X-ray tube, focal spot size 6μm, spatial resolution ＜1.2μm. 2-megapixel detector, inspection speed 280mm/s. Max sample size 500×450mm, supports 65° tilt and 360° rotation, AI-assisted classification, false alarm rate ＜0.6%.