蔚视科 VISCOM X7054-16用途：主要应用于电子制造行业，用于对印刷电路板（PCB）进行检测。能够有效检测焊点质量，识别元件缺陷、位置偏移等问题，保障电子产品生产质量。技术原理：综合运用自动光学检测（AOI）和自动 X 射线检测（AXI）技术。光学部分通过相机采集图像，依据元件和焊点不同的光学特征进行检测。X 射线部分，利用 X 射线穿透物体的特性，不同材料和结构对 X 射线吸收程度有差异，探测器接收穿透后的射线并转化为电信号，经处理生成物体内部影像 。性能：具备高分辨率成像能力，可清晰呈现微小缺陷；检测速度快，能够满足电子制造行业大规模生产检测需求；可对双面组装 PCB 进行检测，利用先进算法精确重建焊点 3D 数字模型，有效减少误报；配备功能丰富的检测软件，便于操作与数据分析；设备结构紧凑，占地面积小 。

Product Name: VISCOM X7054-16Purpose: It is mainly applied to the electronics manufacturing industry for the inspection of printed circuit boards (PCBs). It can effectively detect the quality of solder joints, identify component defects, position offsets, etc., and ensure the production quality of electronic products.Technical Principle: It comprehensively uses automatic optical inspection (AOI) and automatic X-ray inspection (AXI) technologies. The optical part collects images through a camera and detects based on the different optical characteristics of components and solder joints. In the X-ray part, it uses the characteristic of X-rays penetrating objects. Different materials and structures have different absorption degrees of X-rays. The detector receives the penetrated rays and converts them into electrical signals, which are processed to generate an internal image of the object.Performance: It has high-resolution imaging capabilities, which can clearly show tiny defects. It has a fast detection speed and can meet the mass production inspection requirements of the electronics manufacturing industry. It can detect double-sided assembled PCBs and use advanced algorithms to accurately reconstruct the 3D digital model of solder joints, effectively reducing false alarms. It is equipped with detection software with rich functions for easy operation and data analysis. The equipment has a compact structure and a small footprint.