梅威斯 MATRIX X3用途：是一款自动 X 射线检测系统，用于电子生产中的精密高速检测，尤其适用于有关键重叠区域的双面电路板检测。技术原理：基于 MATRIX X2.5 axi 系统的运动理念，采用结合透射与 3D 技术。新开发的 3D 重建软件可生成切片图像，用于焊点的 3D 分析。性能：为高速在线 AXI 系统，采用免维护密封 X 射线管和数字探测器技术。配备 5 轴可编程运动系统，线性驱动样品台适用于高速检测模式。具备在线板料处理功能，可自动调整宽度，能自动进行灰度级和几何校准，采用 CMOS 平板探测器。

Product Name: Mevis MATRIX X3Purpose: It is an automatic X-ray inspection system used for sophisticated high-speed inspection in electronic production, especially suitable for the inspection of double-sided circuit boards with critical overlapping areas.Technical Principle: Based on the motion concept of the MATRIX X2.5 axi system, it adopts combined transmission and 3D technology. A newly developed 3D reconstruction software generates slice images for 3D analysis of solder joints.Performance: It is a high-speed inline AXI system, adopting maintenance-free sealed X-ray tube and digital detector technology. Equipped with a 5-axis programmable motion system, the linear drive sample table is suitable for high-speed inspection mode. It has an inline board handling function with automatic width adjustment, can automatically perform gray-level and geometric calibration, and uses a CMOS flat panel detector.