诺信 NORDSON X3 AXI 自动 X 射线检测系统用途：主要用于电子制造领域，对电子组件、印刷电路板（PCB）及半导体封装进行全面检测。可精准检测焊点缺陷，包括虚焊、短路等问题，也能识别元件内部隐藏的结构异常和位置偏移，广泛应用于生产线在线检测或离线抽检，助力提升产品质量与生产效率。技术原理：系统通过 X 射线发射管发射 X 射线穿透被检测物体，不同材料对 X 射线吸收程度不同，导致透过物体的 X 射线强度分布产生差异。探测器接收 X 射线并将其转化为电信号，经处理生成图像，利用创新算法对图像进行分析，实现对物体内部状况的无损检测。该系统还采用专利数字断层合成技术，能在一次检测周期内获取不同切片高度的多个图像，可清晰区分双面电路板上下层元件，实现无干扰自动检测。性能：具备自动化 2D 和 3D 检测功能，图像质量卓越，缺陷检测能力强且误报率低。检测速度快，能满足高效生产需求。编程快速且直观，利用标准封装库简化培训并确保程序在不同生产线的可移植性。新的图像处理技术融合多种技术和检测算法，提供全面检测覆盖，极大降低误判率。可与诺信 AOI 检测集成，提高故障覆盖率，几乎涵盖所有工艺缺陷。还可选配远程编程和 SPC 软件，提供全面的良率提升解决方案 。
Product Name: Nordson NORDSON X3 AXI Automated X - Ray Inspection SystemUsage: Mainly used in the electronics manufacturing field, it comprehensively inspects electronic components, printed circuit boards (PCBs), and semiconductor packages. It can accurately detect solder joint defects, including cold solder joints, short circuits, etc., and can also identify hidden internal structure abnormalities and position deviations of components. It is widely used for in - line inspection on production lines or off - line sampling inspection, helping to improve product quality and production efficiency.Technical Principle: The system emits X - rays through an X - ray emitter to penetrate the object to be inspected. Different materials have different absorption degrees of X - rays, resulting in different intensity distributions of X - rays passing through the object. The detector receives the X - rays and converts them into electrical signals, which are processed to generate images. Innovative algorithms are used to analyze the images to achieve non - destructive inspection of the internal condition of the object. The system also adopts patented digital tomosynthesis technology, which can acquire multiple images at different slice heights in one inspection cycle, clearly distinguish the upper and lower layer components of double - sided circuit boards, and achieve interference - free automatic inspection.Performance: It has automated 2D and 3D inspection functions, with excellent image quality, strong defect detection ability, and a low false alarm rate. The inspection speed is fast, meeting the needs of high - efficiency production. Programming is fast and intuitive. The use of standard package libraries simplifies training and ensures program portability across different production lines. New image processing technology integrates a variety of techniques and inspection algorithms, providing comprehensive inspection coverage and greatly reducing misjudgment rates. It can be integrated with Nordson AOI inspection to increase fault coverage, covering almost all process defects. Optional remote programming and SPC software can be provided to offer a comprehensive yield improvement solution.