布鲁克 BRUKER D8 Fabline用途：专为半导体制造等行业设计，用于在线 X 射线测量，可对空白或产品晶圆进行前端和后端工艺监测。能测定硅锗（SiGe）、碳化硅（SiC）、绝缘体上硅（SOI）及硅基 III - V 族化合物等材料的厚度、成分和应变，也可测量金属膜及其堆叠的成分与厚度 。技术原理：基于 X 射线衍射技术，X 射线穿透样品，因晶体结构对 X 射线的衍射作用，探测器接收衍射信号，经分析得出样品的晶体结构、取向等信息，进而推断材料的厚度、成分等参数 。性能：配备高亮度 X 射线源，可实现高精度测量。能在无尘室环境下工作，其机器人可处理直径达 300mm 的晶圆，还可配备两个 FOUP 端口，便于质量控制中的常规分析。测量和数据分析可完全自动化，数据准确性高，分辨率可达原子级别，无需校准 。

Product Name: Bruker BRUKER D8 FablinePurpose: Specifically designed for industries such as semiconductor manufacturing, it is used for in-line X-ray measurements and can monitor the front-end and back-end processes of blanket or product wafers. It can determine the thickness, composition, and strain of materials such as silicon germanium (SiGe), silicon carbide (SiC), silicon on insulator (SOI), and III-V-on-Si, as well as measure the composition and thickness of metal films and their stacks.Technical Principle: Based on X-ray diffraction technology, X-rays penetrate the sample. Due to the diffraction of X-rays by the crystal structure, the detector receives the diffraction signals. Through analysis, information such as the crystal structure and orientation of the sample is obtained, and then parameters such as the thickness and composition of the material are inferred.Performance: Equipped with a high-brilliance X-ray source, it can achieve high-precision measurement. It can work in a cleanroom environment. Its robot can handle wafers with a diameter of up to 300mm and can also be equipped with two FOUP ports for routine analysis in quality control. The measurement and data analysis can be fully automated, with high data accuracy and a resolution reaching the atomic level, and no calibration is required.