岛津 SHIMADZU SMX-160GT用途：适用于电子、半导体、精密机械领域，用于微小零部件的高精度三维 CT 检测，可观察内部结构、缺陷及装配状态，助力产品质量控制与故障分析。技术原理：基于 X 射线计算机断层扫描（CT）技术，X 射线穿透样品后，探测器采集多角度投影数据，经计算机算法重建三维断层图像，呈现细微内部结构。性能：X 射线管电压达 160kV，微焦点尺寸 1μm；空间分辨率高，放大倍率最高 2700 倍；2D-CT 分辨率 4096×4096，角度分辨率最高 6000 次（0.06°）；配备金属伪影抑制技术，扫描效率高。

Product Name: SHIMADZU SMX-160GTPurpose: Suitable for electronics, semiconductors and precision machinery fields, used for high-precision 3D CT inspection of micro-components, capable of observing internal structures, defects and assembly status, aiding product quality control and fault analysis.Technical Principle: Based on X-ray computed tomography (CT) technology, after X-rays penetrate the sample, the detector collects multi-angle projection data, and 3D tomographic images are reconstructed through computer algorithms to present fine internal structures.Performance: X-ray tube voltage up to 160kV, micro-focus size 1μm; high spatial resolution, maximum magnification 2700x; 2D-CT resolution 4096×4096, angular resolution up to 6000 times (0.06°); equipped with metal artifact suppression technology, high scanning efficiency.