菲希尔 FISCHER XDV-μ 微区 X 射线荧光镀层测厚仪用途：适用于微电子、精密仪器领域，对微小区域镀层进行厚度与成分分析，可检测芯片引脚、微型连接器的纳米级镀层，满足超高精度工艺的质量验证需求。技术原理：采用微聚焦 X 射线技术，将射线束聚焦至微米级光斑，激发微小区域镀层产生特征荧光，通过高分辨率探测器捕捉信号，结合微区分析算法实现精准测量。性能：测量范围 0.001μm-500μm，分辨率 0.0001μm。最小测量光斑直径 5μm，元素检测覆盖碳（C）至铀（U）。测量时间 0.1-10 秒，样品台行程 20×20mm，具备自动定位功能。

Product Name: Fischer FISCHER XDV-μ Micro-area X-ray Fluorescence Coating Thickness GaugeUsage: Suitable for microelectronics and precision instruments, conducting thickness and composition analysis of coatings in micro-areas. It can detect nanoscale coatings on chip pins and micro connectors, meeting quality verification needs of ultra-high precision processes.Technical Principle: Adopts micro-focus X-ray technology, focusing X-ray beam into micron-level spot to excite characteristic fluorescence from micro-area coatings. High-resolution detector captures signals, with micro-area analysis algorithms for precise measurement.Performance: Measurement range 0.001μm-500μm, resolution 0.0001μm. Minimum measuring spot diameter 5μm, element detection covers C to U. Measurement time 0.1-10s, sample stage travel 20×20mm, with automatic positioning function.