贝克休斯 GE PHOENIX PCBA Analyzer 160T PCB 组件 X 射线检测仪用途：适用于电子制造领域，对印刷电路板（PCB）组件进行无损检测，可识别焊点空洞、BGA/CSP 焊接缺陷及元件内部异常，满足 PCB 组装质量控制需求。技术原理：通过定向 X 射线穿透 PCB 组件，利用不同材料对 X 射线的吸收差异形成影像，结合数字图像处理技术增强缺陷对比度，实现内部结构的清晰呈现。性能：配备 160kV X 射线管，焦点尺寸 10μm，空间分辨率＜2μm。检测速度达 180mm/s，最大样品尺寸 450×350mm，支持 60° 倾斜与 360° 旋转，具备自动缺陷识别功能。

Product Name: Baker Hughes GE PHOENIX PCBA Analyzer 160T PCB Assembly X-ray InspectorUsage: Suitable for electronics manufacturing, conducting non-destructive inspection of printed circuit board (PCB) assemblies. It identifies solder voids, BGA/CSP welding defects and internal component abnormalities, meeting PCB assembly quality control needs.Technical Principle: Penetrates PCB assemblies with directional X-rays, forms images based on absorption differences of X-rays by different materials, and enhances defect contrast with digital image processing to clearly present internal structures.Performance: Equipped with 160kV X-ray tube, focal spot size 10μm, spatial resolution ＜2μm. Inspection speed up to 180mm/s, maximum sample size 450×350mm, supports 60° tilt and 360° rotation, with automatic defect recognition function.