蔚视科 VISCOM X 7056 RS用途：用于电子制造行业，可对印刷电路板（PCB）进行检测。能检测焊点质量，包括隐藏焊点，还能识别元件缺陷、位置偏移等问题，助力保障电子产品生产质量。技术原理：结合自动光学检测（AOI）与自动 X 射线检测（AXI）技术。光学部分通过相机采集图像，利用不同元件和焊点的光学特征差异检测。X 射线部分，X 射线穿透物体，因不同材料和结构对 X 射线吸收程度不同，探测器接收穿透后的射线转化为电信号，经处理生成内部影像。性能：具备同时进行 3D AOI 和 3D AXI 检测能力；X 射线检测分辨率可达 5 至 20μm / 像素，光学检测分辨率最高 8μm；处理时间短，搭配 xFastFlow 处理概念，更换电路板时间可缩至 4 秒；可检测双面组装 PCB，利用平面 CT 算法精确重建焊点 3D 数字模型，减少误报；有 Viscom SPC（统计进程控制）等功能，可进行有效联网和进程优化；设备紧凑，宽度仅 1.3m 。

Product Name: VISCOM X 7056 RSPurpose: It is used in the electronics manufacturing industry and can detect printed circuit boards (PCBs). It can detect the quality of solder joints, including hidden solder joints, and also identify component defects, position offsets, etc., helping to ensure the production quality of electronic products.Technical Principle: It combines automatic optical inspection (AOI) and automatic X-ray inspection (AXI) technologies. The optical part collects images through a camera and detects based on the differences in the optical characteristics of different components and solder joints. In the X-ray part, X-rays penetrate the object. Due to the different absorption degrees of X-rays by different materials and structures, the detector receives the penetrated rays and converts them into electrical signals, which are processed to generate an internal image.Performance: It has the ability to perform 3D AOI and 3D AXI detection simultaneously. The X-ray detection resolution can reach 5 to 20 μm/pixel, and the optical detection resolution is up to 8 μm. The processing time is short. With the xFastFlow processing concept, the time for changing the circuit board can be reduced to 4 seconds. It can detect double-sided assembled PCBs, and use the planar CT algorithm to accurately reconstruct the 3D digital model of solder joints to reduce false alarms. It has functions such as Viscom SPC (Statistical Process Control) for effective networking and process optimization. The equipment is compact, with a width of only 1.3m.