梅威斯 MATRIX XT-6 自动 X 射线检测系统用途：适用于电子制造 SMT 生产线，针对多层 PCB 组件、半导体封装进行高精度检测，可识别微焊点缺陷、BGA/CSP 焊点空洞及元件内部异常，满足高密度组装的质量管控需求。技术原理：采用高分辨率透射 X 射线技术，结合多视角成像与 3D 重构算法。X 射线穿透样品后，探测器接收不同材料的吸收差异信号，经处理生成分层图像，消除层间干扰，精准呈现内部结构。性能：配备 160kV 微焦点 X 射线管，最小焦点 5μm，空间分辨率＜1μm。采用 1600 万像素平板探测器，检测速度达 600mm/s。支持 80° 倾斜与 360° 旋转，最大样品尺寸 510×460mm，具备智能缺陷分类功能，误报率低。

Product Name: Matrix MATRIX XT-6 Automatic X-ray Inspection SystemUsage: Suitable for SMT production lines in electronics manufacturing, conducting high-precision inspection of multi-layer PCB assemblies and semiconductor packages. It identifies micro solder defects, BGA/CSP solder voids and internal component abnormalities, meeting quality control needs of high-density assemblies.Technical Principle: Adopts high-resolution transmission X-ray technology, combined with multi-view imaging and 3D reconstruction algorithms. After X-rays penetrate samples, detectors receive absorption difference signals of different materials, processed into layered images to eliminate interlayer interference and accurately present internal structures.Performance: Equipped with 160kV micro-focus X-ray tube, minimum focal spot 5μm, spatial resolution ＜1μm. Uses 16-megapixel flat panel detector, inspection speed up to 600mm/s. Supports 80° tilt and 360° rotation, maximum sample size 510×460mm, with intelligent defect classification, low false alarm rate.