菲尼克斯 PHOENIX Nanomex 160用途：常用于电子、半导体、材料研究等领域。可对微小电子元件、集成电路等进行二维 X 射线检测，也能借助三维 CT 扫描，对样品内部结构进行无损分析，助力产品研发、质量把控以及失效分析。技术原理：利用 X 射线穿透样品，不同密度物质对 X 射线吸收程度有别，探测器捕捉透射的 X 射线信号并转化为电信号，经计算机处理形成样品内部结构图像。三维 CT 则通过多角度采集数据，重建出三维模型。性能：配备 160kV 高能量 X 射线源，可提供较强穿透能力；拥有高分辨率成像能力，能清晰呈现微小细节；用户可调控 X 射线能量、曝光等参数；具备高动态响应、主动冷却的 DXR 平板探测器，刷新率达 30fps，提供清晰实时图像与高速三维 CT 扫描；最大样品尺寸可达 406mm×406mm，重量限制 5kg 。

Product Name: Phoenix Nanomex 160Purpose: Commonly used in fields such as electronics, semiconductors, and materials research. It can perform 2D X - ray inspection on tiny electronic components, integrated circuits, etc., and with the help of 3D CT scanning, it can conduct non - destructive analysis of the internal structure of samples, contributing to product R & D, quality control, and failure analysis.Technical Principle: X - rays are used to penetrate the sample. Different density materials have different degrees of absorption of X - rays. The detector captures the transmitted X - ray signals and converts them into electrical signals, which are processed by a computer to form an image of the internal structure of the sample. 3D CT reconstructs a 3D model by collecting data from multiple angles.Performance: Equipped with a 160 kV high - energy X - ray source, which can provide strong penetration; has high - resolution imaging capabilities to clearly show tiny details; users can adjust parameters such as X - ray energy and exposure; features a high - dynamic - response and actively cooled DXR flat - panel detector with a refresh rate of 30 fps, providing clear real - time images and high - speed 3D CT scans; the maximum sample size can reach 406 mm×406 mm, with a weight limit of 5 kg.