尼康 NIKON XT V 130用途：用于电子元器件检测，可对复杂电子设备及多层电路板内部故障进行高效排查，适用于生产线上的自动化质量检测及故障分析实验室，如 100% BGA 和 μBGA 检测、多层板及 PCB 焊接点检测等。技术原理：采用 30 - 130kV 开放式微焦点 X 射线源，通过 X 射线穿透检测对象，获取内部结构信息，搭配 4 轴可编程操纵器及基于 4 英寸图像增强器的 16 位成像系统成像 。性能：焦点尺寸最小达 3 微米，几何放大倍率达 320 倍，最大倾斜观测角度 60°，可提供优质图像及检测灵活性。检测区域适配最大 40x35cm 样品。系统分辨率为 3840 x 2160 像素，具备自动检测功能及（选配）电路板自动识别功能，保障检测通量 。

Product Name: Nikon NIKON XT V 130Purpose: It is used for the inspection of electronic components. It can efficiently detect internal failures of complex electronic devices and multi-layer circuit boards. It is suitable for automated quality inspection on production lines and failure analysis laboratories, such as 100% BGA and μBGA inspection, multi-layer board and PCB solder joint inspection, etc.Technical Principle: It adopts a 30 - 130kV open micro-focus X-ray source. The X-ray penetrates the object to be detected to obtain internal structure information, and is equipped with a 4-axis programmable manipulator and a 16-bit imaging system based on a 4-inch image intensifier for imaging.Performance: The focal spot size can reach a minimum of 3 microns, the geometric magnification is up to 320 times, and the maximum tilt observation angle is 60°, which can provide high-quality images and inspection flexibility. The inspection area is suitable for samples up to 40x35cm. The system resolution is 3840 x 2160 pixels, and it has an automatic inspection function and (optional) automatic board identification function to ensure inspection throughput.