尼康 NIKON XT V 160用途：适用于中小型电子元器件检测，能对小型高装配密度印刷电路板上相互遮挡的焊接零件进行无损检测，也用于生产设施及故障分析实验室。可检测 BGA、焊锡空洞、通孔等。技术原理：运用 X 射线透视技术，借助 Nikon 的 Xi NanoTech X 射线微焦点源，穿透检测对象获取内部信息。性能：焦点尺寸达 1μm，可生成 3840x2160 像素精确分辨率图像。配备 16 位平板探测器，实现 2D 与 3D 无缝转换。拥有最大 160kV 能量、20W 真实靶功率，检测区域达 406x406mm，大托盘载物台可放置多件样品，几何放大倍率高，最大倾斜观测角度 75° 。

Product Name: Nikon NIKON XT V 160Purpose: Suitable for the inspection of small and medium-sized electronic components. It can perform non-destructive inspection on the overlapping soldered parts on small, high-density printed circuit boards. It is also used in production facilities and failure analysis laboratories. It can detect BGA, solder voids, vias, etc.Technical Principle: It uses X-ray fluoroscopy technology. With Nikon's Xi NanoTech X-ray micro-focus source, it penetrates the object to be detected to obtain internal information.Performance: The focal spot size reaches 1μm, and it can generate images with an accurate resolution of 3840x2160 pixels. It is equipped with a 16-bit flat panel detector to achieve seamless conversion between 2D and 3D. It has a maximum energy of 160kV, a true target power of 20W, an inspection area of 406x406mm, a large tray stage that can hold multiple samples, a high geometric magnification, and a maximum tilt observation angle of 75°.