诺信 NORDSON X2.5D X 射线检测系统用途：适用于电子制造领域，针对印刷电路板（PCB）组件、半导体封装的复杂结构检测，可识别焊点三维缺陷、元件内部分层及位置偏移，助力精密电子元件的质量控制与失效分析。技术原理：通过多角度发射 X 射线，利用不同材料对 X 射线的吸收差异，结合数字断层合成技术，生成物体内部的分层图像，实现近似三维的结构分析，无需破坏样品即可呈现内部细节。性能：配备 120kV X 射线管，特征分辨率＜1.2μm。采用 200 万像素 CMOS 探测器，15 帧 / 秒实时成像。支持 50° 倾斜检测，几何放大 1600 倍，系统放大 4800 倍。最大样品尺寸 600×500mm，具备自动缺陷识别算法，操作便捷。

Product Name: Nordson NORDSON X2.5D X-ray Inspection SystemUsage: Suitable for electronics manufacturing, targeting complex structure inspection of PCB assemblies and semiconductor packages. It identifies 3D solder defects, internal component delamination and position shifts, aiding quality control and failure analysis of precision electronic components.Technical Principle: Emits X-rays from multiple angles, utilizing different X-ray absorption by materials. Combined with digital tomosynthesis technology, it generates layered images of internal structures, achieving near-3D structural analysis to present internal details without damaging samples.Performance: Equipped with 120kV X-ray tube, feature resolution ＜1.2μm. Uses 2-megapixel CMOS detector, 15fps real-time imaging. Supports 50° tilt inspection, geometric magnification 1600x, system magnification 4800x. Maximum sample size 600×500mm, with automatic defect recognition algorithm, easy to operate.