尼康 NIKON XTV160 X 射线检测系统用途：适用于电子制造、医疗、航空航天等领域，对 PCB 组件、半导体元件及精密部件进行无损检测，可识别焊点缺陷、内部结构异常及位置偏移，满足高精度检测需求。技术原理：通过微焦点 X 射线源发射 X 射线穿透物体，利用材料吸收差异形成强度分布，探测器接收并转化为电信号生成图像，结合图像增强技术呈现细节，实现内部状况分析。性能：焦点尺寸 1μm，缺陷识别达 500nm。几何放大 2.5x-2400x，系统放大最高 36000x。配备 1.45 兆像素相机及可选数字平板，检测区域最大 406×406mm，支持 72° 倾斜与 360° 旋转，5 轴样品台确保操作精准。

Product Name: Nikon NIKON XTV160 X-ray Inspection SystemUsage: Suitable for electronics manufacturing, medical, aerospace fields, conducting non-destructive inspection on PCB assemblies, semiconductors and precision parts. It identifies solder defects, internal structure abnormalities and position shifts, meeting high-precision inspection needs.Technical Principle: Emits X-rays through micro-focus source to penetrate objects. Utilizes material absorption differences to form intensity distribution. Detectors receive and convert to electrical signals for imaging, with image enhancement to present details for internal condition analysis.Performance: Focal spot size 1μm, defect recognition up to 500nm. Geometric magnification 2.5x-2400x, system magnification max 36000x. Equipped with 1.45-megapixel camera and optional digital flat panel. Max inspection area 406×406mm, supports 72° tilt and 360° rotation, 5-axis stage ensures precise operation.