岛津 SHIMADZU SMX-160GT用途：适用于电子、半导体、精密机械等行业，针对微小零部件开展高精度的三维 CT 检测，可精准观察内部结构、检测缺陷以及评估装配状况，为产品质量把控与故障排查提供有力支撑。技术原理：基于 X 射线计算机断层扫描（CT）技术，X 射线源发射射线穿透样品，探测器从不同角度收集投影数据，经先进的计算机算法重建，生成样品的三维断层图像，清晰呈现内部细微结构。性能：采用 1μm 的微焦点管球，实现高分辨率成像；放大倍率最高达 2700 倍，能进行精准尺寸测量；具备超高速重建驱动系统，短时间内即可获取三维图像或 MPR 图像；2D - CT 分辨率可达 4096X4096，角度分辨率在 2D - CT 中最多达 6000 次（0.06 度），并通过精细补偿模式及独特处理技术，降低金属伪影，提升图像质量。

Product Name: SHIMADZU SMX-160GTPurpose: Suitable for industries such as electronics, semiconductors, and precision machinery, it conducts high-precision 3D CT inspections on tiny parts. It can accurately observe internal structures, detect defects, and evaluate assembly conditions, providing strong support for product quality control and troubleshooting.Technical Principle: Based on X-ray computed tomography (CT) technology, the X-ray source emits rays to penetrate the sample. The detector collects projection data from different angles and reconstructs 3D tomographic images of the sample through advanced computer algorithms, clearly presenting internal fine structures.Performance: It uses a 1μm micro-focus tube to achieve high-resolution imaging; the maximum magnification is up to 2700 times, enabling accurate dimension measurement; it has an ultra-high-speed reconstruction drive system, which can obtain 3D images or MPR images in a short time; the 2D - CT resolution can reach 4096X4096, and the angular resolution in 2D - CT can reach up to 6000 times (0.06 degrees). Through the fine compensation mode and unique processing technology, metal artifacts are reduced, and image quality is improved.