SNU PSIS-5006 可能具备高精度（纳米级分辨率）、快速三维扫描能力，支持多参数测量（粗糙度、翘曲等）。采用非接触式测量防损伤，可能有自动化功能，兼容不同尺寸晶圆，数据可可视化，适配半导体晶圆检测需求。

The SNU PSIS-5006 is likely to feature high precision (nanoscale resolution) and rapid 3D scanning capabilities, supporting multi-parameter measurement (such as roughness and warpage). It adopts non-contact measurement to prevent damage, may have automated functions, is compatible with wafers of different sizes, enables data visualization, and meets the needs of semiconductor wafer inspection.