产品名称：东京精密 TOKYO SEIMITSU A-WD-300T 晶圆减薄机用途：主要用于半导体制造中晶圆的减薄工艺，在芯片制造、集成电路生产等领域发挥重要作用，可对不同材质的晶圆进行精确减薄，满足先进制程对晶圆厚度的严格要求。技术原理：通过高精度的研磨技术，利用研磨盘与晶圆表面的相对运动，配合特定的研磨液，将晶圆表面材料逐层去除，以实现减薄目的。设备具备先进的控制系统，能精准调控研磨过程中的各项参数，确保减薄的均匀性和精度。性能：可加工的晶圆尺寸达 300mm 。在减薄精度方面表现出色，能实现极小的厚度偏差，满足半导体制造对高精度的严苛标准。设备运行稳定，具备高效的研磨速率，可在保证质量的前提下，大幅提升生产效率。同时，其自动化程度较高，操作简便，有助于降低人工成本和人为误差 。Product Name：TOKYO SEIMITSU A-WD-300T Wafer Thinning MachinePurpose：It is mainly used for the wafer thinning process in semiconductor manufacturing. It plays an important role in fields such as chip manufacturing and integrated circuit production. It can accurately thin wafers of different materials to meet the strict requirements of wafer thickness in advanced manufacturing processes.Technical Principle：Through high-precision grinding technology, the relative movement between the grinding disc and the wafer surface, combined with a specific grinding fluid, removes the material on the wafer surface layer by layer to achieve the purpose of thinning. The equipment has an advanced control system that can precisely regulate various parameters during the grinding process to ensure the uniformity and accuracy of thinning.Performance：It can process wafers with a size of 300mm. It performs excellently in terms of thinning accuracy, being able to achieve extremely small thickness deviations to meet the stringent high-precision standards of semiconductor manufacturing. The equipment operates stably and has a high grinding rate, which can greatly improve production efficiency while ensuring quality. At the same time, it has a high degree of automation and is easy to operate, helping to reduce labor costs and human errors.