产品名称：东京精密 TOKYO SEIMITSU A-WD-200T 晶圆减薄机用途：用于半导体制造中对 200mm 晶圆进行减薄处理，广泛应用于芯片制造、集成电路等相关领域，满足对晶圆特定厚度的工艺需求，以提升芯片性能及后续制程的适配性。技术原理：通过高精度研磨技术，研磨盘在电机驱动下高速旋转，与固定在工作台上的晶圆表面紧密接触，同时配合专用研磨液，利用研磨盘的物理磨削作用和研磨液的化学辅助作用，逐层去除晶圆表面材料，实现精确减薄。设备搭载先进控制系统，能实时监控和调整研磨参数。性能：可精准加工 200mm 规格晶圆。具备高减薄精度，能将厚度偏差控制在极小范围，满足半导体制造对高精度的严格要求。研磨速率较高，可有效提升生产效率。设备稳定性好，长时间运行仍能保证减薄效果的一致性，且操作简便，自动化程度较高，减少人工干预带来的误差 。Product Name：TOKYO SEIMITSU A-WD-200T Wafer Thinning MachinePurpose：It is used for thinning 200mm wafers in semiconductor manufacturing. It is widely applied in related fields such as chip manufacturing and integrated circuits, meeting the process requirements for specific wafer thicknesses to improve chip performance and the adaptability of subsequent manufacturing processes.Technical Principle：Through high-precision grinding technology, the grinding disc rotates at a high speed driven by a motor and makes close contact with the surface of the wafer fixed on the workbench. At the same time, it cooperates with a special grinding fluid. Using the physical grinding effect of the grinding disc and the chemical assistance of the grinding fluid, the material on the wafer surface is removed layer by layer to achieve precise thinning. The equipment is equipped with an advanced control system that can monitor and adjust grinding parameters in real time.Performance：It can accurately process wafers of 200mm specifications. It has high thinning accuracy and can control the thickness deviation within a very small range, meeting the strict requirements for high precision in semiconductor manufacturing. The grinding rate is relatively high, which can effectively improve production efficiency. The equipment has good stability and can still ensure the consistency of the thinning effect during long-term operation. It is easy to operate and has a high degree of automation, reducing errors caused by manual intervention.