产品名称：DISCO DAD341 自动晶圆切割划片机。用途：主要用于半导体制造过程中晶圆的切割划片，将晶圆分割成单个的芯片。技术原理：通过 30000-60000 转 / 分钟的高速旋转主轴带动金刚石刀片，对晶圆表面进行强力磨削切割。采用四轴联动设计，X 轴控制样品水平进给，Y 轴调节刀片进刀方向，Z 轴精确控制切割深度，θ 轴实现样品平面旋转定位。切割过程中同步喷射高纯度恒温冷却水，以保证切割效果。性能：可处理 8 英寸（□250，φ300mm/DPR）的工件，X 轴切割速度范围为 0.1-600mm/sec，Y 轴切割范围为 260mm，定位精度为 0.002/260mm（单次误差）、0.002/5mm。Z 轴最大行程为 32.2mm（1.8kW 机型）和 31.4mm（2.2kW 机型），重复定位精度为 0.001mm。θ 轴最大旋转角度为 380°。主轴输出功率有 1.8kW 和 2.2kW 两种，转速范围为 6000-60000min⁻¹（1.8kW）和 3000-30000min⁻¹（2.2kW）。Product Name：DISCO DAD341 Automatic Dicing Saw.Purpose：It is mainly used for dicing wafers in the semiconductor manufacturing process, dividing wafers into individual chips.Technical Principle：It drives a diamond blade through a high - speed rotating spindle at 30000 - 60000 revolutions per minute to strongly grind and cut the wafer surface. Adopting a four - axis 联动 design, the X - axis controls the horizontal feed of the sample, the Y - axis adjusts the blade feed direction, the Z - axis precisely controls the cutting depth, and the θ - axis realizes the planar rotation positioning of the sample. High - purity constant - temperature cooling water is synchronously sprayed during the cutting process to ensure the cutting effect.Performance：It can process workpieces of 8 inches (□250, φ300mm/DPR). The X - axis cutting speed range is 0.1 - 600mm/sec, the Y - axis cutting range is 260mm, and the positioning accuracy is 0.002/260mm (single - error) and 0.002/5mm. The Z - axis maximum stroke is 32.2mm (1.8kW model) and 31.4mm (2.2kW model), and the repeatability accuracy is 0.001mm. The θ - axis maximum rotating angle is 380°. The spindle output power has two types of 1.8kW and 2.2kW, and the speed range is 6000 - 60000min⁻¹ (1.8kW) and 3000 - 30000min⁻¹ (2.2kW).