产品名称：CELLESTA 系列单晶圆清洗设备。用途：广泛应用于半导体制造过程中的单晶圆清洗工艺，可用于 300mm 单片前道 / 后道表面清洗、湿法刻蚀等工艺。技术原理：整合双流体喷雾技术和刷头的物理清洗功能，部分型号如 CELLESTA SCD 配备超临界干燥专用反应室，利用超临界流体基本无表面张力的特性，防止干燥时微细图案结构被破坏。性能：可根据工厂布局要求，灵活调节 4 至 12 个腔室，每小时可处理多达 1000 枚晶圆。例如 CELLESTA MS2 清洗晶圆双面的生产率较现有 TEL 设备高出 1.5 倍以上，且无需使用纯水和气体保护晶圆非清洗面，降低了厂务成本。Product Name：CELLESTA series single - wafer cleaning equipment.Purpose：Widely used in the single - wafer cleaning process in the semiconductor manufacturing process, and can be used for front - end/back - end surface cleaning of 300mm single - wafers, wet etching and other processes.Technical Principle：Integrates the physical cleaning functions of dual - fluid spray technology and brush heads. Some models such as CELLESTA SCD are equipped with a supercritical drying - specific reaction chamber. It uses the characteristic that supercritical fluid has basically no surface tension to prevent the 微细 pattern structure from being damaged during drying.Performance：The number of chambers can be flexibly adjusted from 4 to 12 according to the factory layout requirements, and it can process up to 1000 wafers per hour. For example, the productivity of CELLESTA MS2 for cleaning both sides of wafers is 1.5 times higher than that of the existing TEL equipment, and there is no need to use pure water and gas to protect the non - cleaning surface of the wafer, reducing the factory utility cost.