产品名称：迪恩士 DNS/DAINIPPON SCREEN SS-3000-AR 晶圆清洗机。用途：主要用于半导体制造中 200mm/300mm 晶圆的清洗，可去除晶圆表面的微小颗粒、光刻胶残留、金属离子等杂质。技术原理：采用兆声波与喷淋双模式清洗技术，搭配不同化学试剂如 SC1/SC2，通过机械臂自动操作晶圆的进出，可实现对晶圆的高效清洁，清洗后还具备热风烘干功能。性能：可处理 200mm/300mm 的晶圆，颗粒去除率达 99.9% 以上，每小时清洗产能为 150 片，清洗液温度可在室温至 80℃之间调节，设备通过 SECS/GEM 协议与产线通信，可实时同步洁净度数据。Product Name：DNS/DAINIPPON SCREEN SS-3000-AR Wafer Scrubber.Purpose：It is mainly used for cleaning 200mm/300mm wafers in semiconductor manufacturing, which can remove impurities such as tiny particles, photoresist residues and metal ions on the wafer surface.Technical Principle：It adopts the cleaning technology of megasonic wave and spraying dual - mode, and is matched with different chemical reagents such as SC1/SC2. The robot arm automatically operates the entry and exit of wafers, realizing efficient cleaning of wafers. It also has a hot - air drying function after cleaning.Performance：It can process 200mm/300mm wafers, with a particle removal rate of over 99.9%. The cleaning capacity is 150 wafers per hour. The temperature of the cleaning liquid can be adjusted from room temperature to 80℃. The equipment communicates with the production line through the SECS/GEM protocol, which can synchronize the cleanliness data in real - time.