应用材料导体刻蚀设备（APPLIED MATERIALS CONDUCTOR ETCH）用途：用于在芯片制造过程中精确图案化和塑造更小的特征，能处理 3D NAND、DRAM 和逻辑芯片，包括鳍式场效应晶体管（FinFET）和新兴的全环绕栅极架构等。技术原理：运用创新的射频脉冲技术，通过高电导腔室架构，快速有效地排出每次晶圆通过时积累的蚀刻副产物，实现出色的蚀刻轮廓控制。性能：具备极高的材料选择性、深度控制和轮廓控制能力，可创建密集排列、高深宽比的结构；新的专有涂层减少制造缺陷并提高晶圆良率；通过新型静电卡盘降低晶圆上芯片间的差异，利用主动边缘控制提高晶圆极端边缘的良率。

Product Name: APPLIED MATERIALS CONDUCTOR ETCHPurpose: It is used to precisely pattern and shape smaller features during chip manufacturing, capable of handling 3D NAND, DRAM, and logic chips, including FinFETs and emerging gate - all - around architectures.Technical Principle: It uses innovative RF pulsing technology. Through a high - conductance chamber architecture, it quickly and efficiently exhausts the etch byproducts accumulated with each wafer pass to achieve excellent etch profile control.Performance: It has extremely high material selectivity, depth control, and profile control capabilities, enabling the creation of densely packed, high - aspect - ratio structures. The new proprietary coating reduces manufacturing defects and improves wafer yield. A novel electrostatic chuck reduces die - to - die variability across the wafer, and active edge control improves the extreme edge of the wafer yield.